Simulative Study of Machining Mechanism of Material in Micro-EDM

Journal of System Simulation ›› 2015, Vol. 27 ›› Issue (12): 2891-2897.

Previous Articles Next Articles

Simulative Study of Machining Mechanism of Material in Micro-EDM

Wang Shi^1,2, Guo Jianwen^2,3, Jiang Wuxue¹, Cao Wenliang¹

1. Department of Computer Engineering, Dongguan Polytechnic, Dongguan 523808, China;
2. DG-HUST Manufacturing Engineering Institute, Dongguan 523808, China;
3. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

Received:2014-12-17 Revised:2015-04-19 Online:2015-12-08 Published:2020-07-30

Abstract

Abstract: Great complexity and randomness exist in micro-electrical discharge machining (micro-EDM) process. Considering the limitations of molecular dynamics model and numerical model based on heat transfer theories in studies on machining mechanism of micro-EDM, a hybrid modeling method in which the two-temperature model and molecular dynamics simulation model were integrated was used to construct the machining model for the anode in micro-EDM process, and the corresponding parallel simulation platform was built based on MPI technology. In this simulation model, a heat source was placed in the electron system to mimic the thermal action of the discharge channel on the anode material, and furthermore, by analyzing temporal-spatial evolutions of temperature and stress in the anode material and temperature in the electron system, different machining mechanisms of anode material were revealed correspondingly when different amounts of energy were input.

Key words: micro-electrical discharge machining, molecular dynamics simulation, two-temperature model, MPI programming, parallel algorithm

CLC Number:

TG661

Wang Shi, Guo Jianwen, Jiang Wuxue, Cao Wenliang. Simulative Study of Machining Mechanism of Material in Micro-EDM[J]. Journal of System Simulation, 2015, 27(12): 2891-2897.

References

[1] Terry O, Hockenberry, Everard M.Williams. Dynamic Evolution of Events Accompanying the Low-Voltage Discharges Employed in EDM[J]. Industry and General Applications IEEE Transactions on (S0018-943X), 1967, 3(4): 302-309.
[2] JLGuerrero-Alvarez, JEGreene, BFVon Turkovich.Study of the electro-erosion phenomenon of Fe and Zn[J]. Journal of Manufacturing Science and Engineering (S1087-1357), 1973, 95(4): 965-971.
[3] Wang Bor-Jenq, Saka Nannaji, Rabinowicz Ernest.Static-gap single-spark erosion of Ag-CdO and pure metal electrodes[J]. Wear (S1068-3666), 1992, 157(1): 31-49.
[4] J Marafona, AG Chousal. A finite element model of EDM based on the Joule effect[J]. International Journal of Machine Tools and Manufacture (S0890-6955), 2006, 46(6): 595-602.
[5] Wuyi Ming, Guojun Zhang, He Li, et al. A hybrid process model for EDM based on finite-element method and Gaussian process regression[J]. The International Journal of Advanced Manufacturing Technology (S0268-3768), 2014, 74(6): 1197-1211.
[6] Vinod Yadav, Vijay K Jain, Prakash M.Dixit. Thermal stresses due to electrical discharge machining[J]. International Journal of Machine Tools and Manufacture (S0890-6955), 2002, 42(8): 877-888.
[7] Guojun Zhang, Jianwen Guo, Wuyi Ming, et al. Study of the machining process of nano-electrical discharge machining based on combined atomistic-continuum modeling method[J]. Applied Surface Science (S0169-4332), 2014, 290(11): 359-367.
[8] Dmitriy SIvanov, Leonid V, Zhigilei. Combined atomistic-continuum modeling of short-pulse laser melting and disintegration of metal films [J]. Physical Review B (S1098-0121), 2003, 68(6): 064114.1-22.
[9] H N G Wadley, X Zhou, RAJohnson, M Neurock. Mechanisms, models and methods of vapor deposition[J]. Progress in Materials Science (S0079-6425), 2001, 46(3): 329-377.
[10] S IAnisimov, B L Kapeliovich, T L Perel’Man. Electron emission from metal surfaces exposed to ultrashort laser pulses[J]. Zh. Eksp. Teor. Fiz (S0021-3640), 1974, 66(776): 375-381.
[11] K Furusawa, K Takahashi, H Kumagai, et al. Ablation characteristics of Au, Ag, and Cu metals using a femtosecond Ti: sapphire laser[J]. Applied Physics A (S1432-0630), 1999, 69(1): S359-S366.
[12] Zhibin Lin, Leonid VZhigilei, Vittorio Celli.Electron-phonon coupling and electron heat capacity of metals under conditions of strong electron-phonon nonequilibrium[J]. Physical Review B (S1098-0121), 2008, 77(7): 439-446.
[13] Wolfgang Wagner, Andreas Pruß.The IAPWS formulation 1995 for the thermodynamic properties of ordinary water substance for general and scientific use[J]. Journal of Physical and Chemical Reference Data (S0047-2689), 2002, 31(2): 387-535.
[14] Jim Douglas.Alternating direction methods for three space variables[J]. Numerische Mathematik (S0945-3245), 1962, 4(1): 41-63.
[15] Van G W F, Berendsen H J C. A leap-frog algorithm for stochastic dynamics[J]. Molecular Simulation (S0892-7022), 1988, 1(3): 173-185.
[16] Rapaport D C.Multi-million particle molecular dynamics: II. Design considerations for distributed processing[J]. Computer Physics Communications (S0010-4655), 1991, 62(2): 217-228.

Simulative Study of Machining Mechanism of Material in Micro-EDM

PDF (PC)

Knowledge

Cited

Abstract

Cite this article

share this article

References

Related Articles 4

Recommended Articles

Metrics

Comments

[1]	Tang Wenjie, Cheng Junwei, Yao Yiping, Zhu Feng. A Shared Memory Based Parallel Hierarchical Interest Matching Algorithm [J]. Journal of System Simulation, 2021, 33(5): 1086-1094.
[2]	Liu Fuchang, Wang Shuangjian, Pan Zhigeng, Wang Jinrong. Survey on Parallel Collision Detection Algorithms [J]. Journal of System Simulation, 2017, 29(11): 2601-2608.
[3]	Dong Haijun, Lu Xiaoqing, Zhang Haopeng, Shan Mingming. Molecular Dynamics of Fluid Properties by Spanwise Oscillations of Solid Wall [J]. Journal of System Simulation, 2015, 27(9): 1927-1934.
[4]	Dong Haijun, Lu Xiaoqing, Zhang Haopeng, Shan Mingming. Molecular Dynamics of Fluid Properties by Normal Oscillations of Solid Wall [J]. Journal of System Simulation, 2015, 27(8): 1680-1686.