Simulation of Transient Temperature Field of Current-carrying Sliding Friction Pair

doi:10.16182/j.issn1004731x.joss.201805012

Abstract

Abstract: The transient temperature rise of pantograph and catenary system could affect material properties of the friction pair, which accelerates the wear of system. In order to reduce the wear caused by temperature, transient temperature and distribution of copper/copper-carbon friction pair are studied. A simulation model is established by using COMSOL Multiphysics software. Model effectiveness is verified with temperature experiments. The transient process of temperature field is studied by simulation. The results show that the temperature rise of carbon plate has small cyclical peaks. The highest temperature appears on the contact region in the initial stage of running. Temperature gradient is larger in front of the direction of relative movement, and "high temperature trailing" phenomenon appears in the back. Temperature on contact region is slightly lower in middle and late stage of running. And temperature in front of the direction of relative movement is higher. Temperature rise of copper wire is gentle and overall low. The temperature gradient is smaller in the direction of running. These results will provide certain references to further study on the temperature characteristics of the friction pair.

Key words: transient temperature field, temperature gradient, high temperature trailing phenomenon, sliding electrical contact

CLC Number:

TM501

Guo Fengyi, Gao Hongxin, Liu Shuai, Wang Zhiyong, Zhang Kai, Wang Aijun. Simulation of Transient Temperature Field of Current-carrying Sliding Friction Pair[J]. Journal of System Simulation, 2018, 30(5): 1715-1723.

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