Analysis the Nano Contact Force of Single Crystal Copper in Contact and Separation Processes

Abstract

Abstract: On the basis of considering the adhesive force and copper substrate elastic-plastic deformation, the contact and separation processes between diamond indenter and copper substrate are simulated based on EAM and Morse potentials and Verlet algorithm. The results show that, when diamond indenter approaches slowly to copper substrate during the contact process, some atoms at the top level of substrate happened “snap back” phenomenon significantly due to the gravity became the main interaction force. Furthermore, it can be seen that the contact force and the accumulation phenomenon of dislocation atoms increase gradually with the increment of diamond displacements. During in separation process, the contact force decreases continuously with the declines of diamond indenter, the adhesive hysteresis phenomenon and some atoms adhered to the surface of diamond indenter can be seen obviously after separation absolutely.

Key words: contact force, molecular dynamics, adhesive contact and separation

CLC Number:

TH117.1

Huang Jianmeng, Chen Jingjing. Analysis the Nano Contact Force of Single Crystal Copper in Contact and Separation Processes[J]. Journal of System Simulation, 2015, 27(2): 404-409.

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